http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001196471-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_294881271413951a95f284b588a68e66
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-316
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8234
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-265
filingDate 2000-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0231a17b8bb71b0439b758994851cd4c
publicationDate 2001-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001196471-A
titleOfInvention Method for manufacturing semiconductor device
abstract [PROBLEMS] To separately form the thickness of a gate insulating film without damaging a semiconductor substrate on which the gate insulating film is formed while eliminating an influence on transistor characteristics and an increase in the number of exposure masks. Provided is a method for manufacturing a semiconductor device. A thin second gate oxide film formed on a semiconductor substrate in a second region passes through a step of removing a through oxide film after ion implantation and forming a gate oxide film only once. . Also, since the through oxide film 20 in the first region is removed using the resist film R1 as a mask, after the resist film R1 is removed, Since the through oxide film 20 remains, when the threshold adjustment ions are implanted into the semiconductor substrate 10 in the second region thereafter, This through oxide film 20 can be used. Further, the ion implantation of the conductive impurity and the removal of the through oxide film for ion implantation are performed using the same mask.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004040093-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007088494-A
priorityDate 2000-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707758
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID450646340
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID176015

Total number of triples: 21.