abstract |
PROBLEM TO BE SOLVED: To provide an effect of improving an exposure margin (especially, an exposure margin of an isolated line) in manufacturing a semiconductor device, that is, a positive line having a small line width variation of an isolated line when an exposure amount is changed. Providing a mold photoresist composition. (A) a compound generating a sulfonic acid represented by a specific structure, (B) a specific silicon-containing repeating unit, and at least one of repeating units having a specific structure, A positive photoresist composition comprising an acid-decomposable resin whose solubility in an alkaline developer is increased by the action of an acid. |