http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001192533-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-26 |
| filingDate | 2000-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab44d7cdaf588bd1f40228515bc4b250 |
| publicationDate | 2001-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001192533-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound, and is excellent in moldability, flame retardancy, high-temperature storage characteristics, humidity resistance and solder crack resistance. Providing a composition. SOLUTION: (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, and (E) 1 to 15% by weight of a general formula (1) in the total epoxy resin composition. ) And (F) an ion scavenger represented by the general formula (2) as an essential component in the total epoxy resin composition, and (D) and (E). ) And (F) in a total amount of 70 to 93 in the total epoxy resin composition. An epoxy resin composition for encapsulating a semiconductor, which is contained in a weight percentage. Mg 1-x M 2+ x (OH) 2 (1) (where M 2+ is Mn 2+ , Fe 2+ , Co 2+ , Ni 2+ , Cu Represents at least one kind of divalent metal ion selected from the group consisting of 2+ and Zn 2+ , and x represents a number of 0.01 ≦ x ≦ 0.5) Mg a Al b (OH) 2a + 3b -2c (CO 3 ) c · dH 2 O (2) (where 0 <b / a ≦ 1, 0 ≦ c / b <1.5, and d is a positive number) |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104220520-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006206748-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006299206-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013146222-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013203767-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5870090-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2012133923-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005336362-A |
| priorityDate | 2000-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.