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filingDate 1999-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2001-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001189333-A
titleOfInvention Semiconductor device and manufacturing method thereof
abstract (57) [Problem] To provide a semiconductor device excellent in curability, bending strength, filling property, and appearance by using an injection molding machine using a molding material excellent in long-term storage stability at room temperature. An epoxy resin molding material containing an epoxy resin, a phenol resin, a curing accelerator, and an inorganic filler as essential components, and an A component obtained by mixing, heating, melting, kneading, and crushing an epoxy resin and an inorganic filler; Using a molding material obtained by mixing a phenolic resin with a curing accelerator and the remaining inorganic filler, heating and melting, kneading, and crushed B components before heat molding, the semiconductor element has a screw-in-line injection unit. A semiconductor device characterized by being sealed by an injection molding machine.
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