http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001185517-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
filingDate 1999-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d55325fe40d7c5160b13603d4510d3ff
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c904652697a2ebe2a421e28cf506cb59
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecd38b434e0710ff2ef1ff7a6738426b
publicationDate 2001-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001185517-A
titleOfInvention CMP polishing method
abstract (57) [Problem] A CM that can selectively polish a surface to be polished, can be highly flattened, and is excellent in productivity and workability. Provide a P polishing method. SOLUTION: Liquid A containing 0.5 to 10% by weight of cerium oxide particles, 0.003 to 0.3% by weight of surfactant and water, and 0.5 to 10% by weight of surfactant and water Is supplied through a first pipe and a second pipe, respectively, and the first pipe and the second pipe are joined to a third pipe to mix the liquid A and the liquid B, and to form a mixed liquid. Get A CMP polishing method in which the mixed liquid is supplied from a third pipe onto a polishing pad and polished, wherein the flow rate of the mixed liquid in the third pipe is 50 to 500 ml per minute, and the end of the third pipe is A time period for the mixed solution to flow from the other end to the other end is 1 to 300 seconds.
priorityDate 1999-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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