http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001181481-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1999-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dccfd35771d7fbe43712c1ae8d33a4c8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f895a71e7f398046b1fc8a45def89d7 |
| publicationDate | 2001-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001181481-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation |
| abstract | (57) [Abstract] [Problem] High fluidity, good filling, solder heat resistance, Provided is an epoxy resin composition for semiconductor encapsulation, which is excellent in moisture resistance, moisture resistance reliability, and the like. An epoxy resin (a), a curing agent (b) for an epoxy resin, a curing accelerator (c), and The inorganic filler (e) containing the layered compound (d) is an essential component, and the equivalent ratio of the epoxy resin (a) to the curing agent (b) is 0.5 to 2.5. 0, the amount of the curing accelerator (c) is in the range of 0.4 to 20 parts by weight per 100 parts by weight of the total of (a) and (b), and the amount of the inorganic filler (e) is (a). ) And (b) in the range of 200 to 2400 parts by weight per 100 parts by weight of the inorganic filler (e) and the compounding amount of the layered compound (d) in the inorganic filler (e) is the sum of (a) and (b) The range is 0.1 to 20 parts by weight per 100 parts by weight. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2546275-A2 |
| priorityDate | 1999-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 42.