http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001177106-A

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filingDate 2000-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45fd6994e7817513efdd9c5de9e3c627
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publicationDate 2001-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001177106-A
titleOfInvention Semiconductor device and manufacturing method thereof
abstract PROBLEM TO BE SOLVED: To improve characteristics of a semiconductor device having a transistor using a thin film polycrystalline silicon for a channel portion. SOLUTION: The semiconductor device comprises a gate electrode 2, a source electrode, The transistor includes a drain region 3 and a channel portion 4. There is a dangling bond in the source / drain region 3 and the channel portion 4 formed of thin-film polycrystalline silicon, and the characteristics of the transistor deteriorate. In order to terminate the dangling bond, hydrogen is diffused from the plasma silicon nitride film 16 and hydrogen is introduced into the channel portion 4. Since hydrogen cannot pass through the silicon nitride film 6, an opening is made in the silicon nitride film 6, and hydrogen reaches the channel portion 4 along the interface of the metal plug 9 embedded in the opening. By opening the silicon nitride film 6, dangling bonds can be terminated, and the characteristics of the semiconductor device can be improved.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108511459-A
priorityDate 1991-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 25.