http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001168113-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J145-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
filingDate | 1999-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf82d4c8d861073cabb801ca31ca7040 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03ebc9ad416c77d2994dc6262833b0fe |
publicationDate | 2001-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2001168113-A |
titleOfInvention | Adhesive composition for semiconductor element and semiconductor device using the same |
abstract | PROBLEM TO BE SOLVED: To provide an adhesive composition for a semiconductor element excellent in reflow crack resistance by relaxing thermal stress generated in a series of semiconductor device manufacturing steps, and manufactured by using the adhesive composition. Provided is a semiconductor device having excellent connection reliability. A semiconductor element comprising a polymer obtained by metathesis polymerization having an elastic modulus at room temperature of 1.5 GPa or less and a number average molecular weight of 5,000 to 500,000, and a thermosetting resin or a photocurable resin. Adhesive composition. A semiconductor device in which a semiconductor element is mounted on a mounting substrate via an adhesive member using the semiconductor element adhesive composition. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012507600-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009028484-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021153417-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013048295-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006114756-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010050480-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009059917-A |
priorityDate | 1999-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 266.