| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e43b4ca6b41ce9f54c9a895d474c81a |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 |
| filingDate |
1999-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a1f3c8b3f9e81a9b988aa850abf54a6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f3ef174d97b4a7329637acd375a4b54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d88b6e4202256f2b432fef2a48c73d4b |
| publicationDate |
2001-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001166471-A |
| titleOfInvention |
Photosensitive resin composition and photosensitive film using the same |
| abstract |
(57) Abstract: Provided is a photosensitive resin composition which is excellent in flexibility and solder heat resistance, can be developed with a dilute alkali solution, is suitable for etching resist and coverlay, and a photosensitive film using the same. I do. A diamine compound (a) is reacted with a polybasic acid anhydride (b) having two acid anhydride groups in a molecule and a (meth) acrylate (c) having one epoxy group in a molecule. A photosensitive resin composition developable with an aqueous alkali solution, comprising a carboxyl group-containing polyamide oligomer (A) and a photopolymerization initiator (B). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4716073-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003015293-A |
| priorityDate |
1999-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |