http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001164092-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1999-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be430bad0577b49f0fdf311a83fad1f3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7fafbe833382bbc30babb4740273ad3d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a2ddd996b6f15e904d4e4eb2fd8c3f6 |
| publicationDate | 2001-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001164092-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Problem] To provide an epoxy resin composition having high solder heat resistance. An epoxy resin composition comprising an epoxy resin (A), a curing agent (B), and a filler (C), wherein the cured product of the resin composition has a linear expansion coefficient α 1 or less that is equal to or lower than the glass transition temperature. 8.5 × 10 −6 / K or less, and a coefficient of linear expansion α 2 above the glass transition temperature of 35.0 × 10 −6 / K or less, and the cured product of the resin composition has a glass transition point of 120. An epoxy resin composition characterized by being within a range of from -145 ° C. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015207603-A |
| priorityDate | 1999-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 65.