| abstract |
PROBLEM TO BE SOLVED: To provide an epoxy resin for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound, and is excellent in moldability, flame retardancy, high-temperature storage characteristics, humidity resistance and solder crack resistance. Providing a composition. SOLUTION: (A) Epoxy resin, (B) phenolic resin, (C) curing accelerator, (D) inorganic filler, (E) magnesium hydroxide, and (F) boric acid represented by the general formula (1) An epoxy resin composition for encapsulating a semiconductor, comprising zinc as an essential component. pZnO · qB 2 O 3 · rH 2 O (1) ( wherein p, q, r are positive numbers) |