| abstract |
(57) [Problem] To provide both a good heat resistance and a low stress property, and to provide a photosensitive resin composition having a good property as a stress relaxation layer in addition to a conventional application, a method for producing a pattern, and reliability. Provide excellent electronic components. In a photosensitive resin composition containing a polyimide precursor, the polyimide precursor has a transmittance of 1% or more of light having a wavelength of 365 nm per 10 μm of film thickness formed from the precursor. A polyimide obtained by ring-closing the polyimide precursor, Contains a polyimide precursor whose ratio (α2 / α1) of thermal expansion coefficient (α1) at a temperature lower than the glass transition temperature to thermal expansion coefficient (α2) at a temperature higher than the glass transition temperature satisfies 1 to 50 Resin composition, pattern manufacturing method and electronic component. |