http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001154358-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
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filingDate 1999-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf3bbfae1495c9c84d4baa197b6480f1
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publicationDate 2001-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001154358-A
titleOfInvention Processing method of positive photosensitive resin composition and semiconductor device
abstract PROBLEM TO BE SOLVED: To provide a method of processing a positive photosensitive resin composition capable of obtaining a high-sensitivity pattern with a high residual film ratio even in a thick film processing. SOLUTION: This is a two-layer organic film of a positive photosensitive resin composition having a different amount of film reduction in an unexposed part. The positive photosensitive resin composition is coated on a support, dried, and further coated thereon. After applying and drying a positive photosensitive resin composition having a smaller amount of film loss in an unexposed area than the positive photosensitive resin composition of the first layer, This is a method of forming a pattern by exposing and developing.
priorityDate 1999-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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