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filingDate 1999-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc9c35c33756a8d183aee7e7fdc5b9c5
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publicationDate 2001-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001151995-A
titleOfInvention Thermosetting resin composition and insulating resin sheet using the same
abstract (57) Abstract: A thermosetting resin composition having flame retardancy without using a halogen compound such as a brominated epoxy resin, and having excellent heat resistance and crack resistance, and a print using the same. To provide an insulating film for a wiring board. (A) an epoxy resin; and (b) a thermosetting resin comprising a compound having a dihydrobenzoxazine ring; (c) a modified epoxy resin 100 comprising a phenol, a compound having a triazine ring and a polycondensate of an aldehyde A varnish comprising a thermosetting resin composition comprising 10 to 30 parts by weight of a flexibilizer and 5 to 25 parts by weight of a phosphorus-based flame retardant is applied to a carrier film, and dried to form an insulating resin sheet. I do.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004231788-A
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