http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001151987-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 1999-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c582af4953dc949de558535887f88655 |
| publicationDate | 2001-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001151987-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound and has excellent flame retardancy. SOLUTION: (A) an epoxy resin having a pyrene structure of the formula (1), (B) a phenol resin, (C) a curing accelerator, and (D) 70 to 94% by weight in the total epoxy resin composition. In the epoxy resin composition containing the contained inorganic filler as an essential component, carbon atoms having a pyrene structure of the formula (1) are 10 to 85% by weight based on all carbon atoms in the epoxy resin having a pyrene structure of the formula (1). % Of an epoxy resin composition for semiconductor encapsulation. Embedded image |
| priorityDate | 1999-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.