| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15174
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-16 |
| filingDate |
1999-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b156fccee8ca1b23d6e152d59de4b812
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c979eb7385c9cec24764a16d3497a2d |
| publicationDate |
2001-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001144410-A |
| titleOfInvention |
Printed wiring board and method for manufacturing printed wiring board |
| abstract |
(57) [Problem] To provide a small diameter through hole in a resin plate serving as a core substrate by a laser and to have excellent connectivity and reliability without causing peeling of a plating film in the through hole. It is to propose a high-density printed wiring board and a method for manufacturing the printed wiring board. SOLUTION: A small diameter through hole can be formed by opening a core substrate 30 made of an insulating resin with a laser. After that, the metal layer 32 is formed by sputtering. Thereby, the connectivity in the through hole is enhanced. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012054296-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101481851-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006120977-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010532582-A |
| priorityDate |
1999-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |