| abstract |
(57) [Summary] (Modifications required) [Problem] While eliminating the need for an underfill resin, alleviates deformation stress acting on metal bumps to improve mounting reliability and avoid damage to peripheral devices and the like during reproduction processing. In addition, the present invention provides a semiconductor device which can be manufactured at low cost and a method for manufacturing the same. A semiconductor device includes a semiconductor chip in which electrode pads formed on a semiconductor substrate are connected to corresponding electrodes of a multilayer wiring board via metal bumps, and covers the semiconductor substrate. An insulating resin layer 20 having an opening 20a for exposing the pad 12; and a rewiring pattern portion 2 having one end connected to the electrode pad 12 and the other end protruding from the opening 20a and extending over the insulating resin layer 20. 4a, insulating resin layer 20 and rewiring pattern portion 24a Insulating stress buffer resin layer 27 having elasticity And a conductive bump 28 buried in the insulating stress buffer resin layer 27 and connecting the other end of the rewiring pattern portion 24a to the metal bump 25. |