http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001144177-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d7576285d411d00c697e07270d2814a |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 |
| filingDate | 1999-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_895385a4310d041e634e23ae2cc2bab2 |
| publicationDate | 2001-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001144177-A |
| titleOfInvention | Method of manufacturing thin film circuit component having air bridge |
| abstract | (57) [PROBLEMS] To prevent the air bridge wiring from being damaged or dropped due to pressure or vibration caused by cooling water or cutting water applied to a thin film circuit board. SOLUTION: A step of forming a conductive pattern and an air bridge wiring on the surface of a material, and using a plasma treatment or a resist solution to leave a photosensitive resist under the air bridge wiring, A first resist removing step of removing, a dicing step of singulating a component having an air bridge wiring, and a second resist removing step of completely removing a photosensitive resist under the air bridge wiring with a resist solution. Have. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003017964-A |
| priorityDate | 1999-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 16.