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filingDate 1999-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2001-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001139818-A
titleOfInvention Thermally conductive silicone rubber composition
abstract (57) [Abstract] (With revision) [Problem] To obtain silicone rubber having high thermal conductivity, Provided is a thermally conductive silicone rubber composition having good handleability and moldability even when a large amount of a thermally conductive filler is contained. (A) An organopolysiloxane having an average of at least 0.1 silicon-bonded alkenyl group in one molecule, and (B) an organopolysiloxane having an average of two or more silicon-bonded hydrogen atoms in one molecule. Organopolysiloxane, (C) a thermally conductive filler, and (D) a thermally conductive silicone rubber composition comprising a platinum-based catalyst, wherein the surface of the component (C), (E) General formula: R 1 R 2 a Si (OR 3 ) (3-a) wherein R 1 is an alkyl group having 4 to 20 carbon atoms, and R 2 is a phenyl group or 1 to 3 carbon atoms. And R 3 has 1 carbon atom And a is an integer of 0 to 2. ) A thermally conductive silicone rubber composition characterized by being treated with an alkylalkoxysilane represented by the formula: or a partial hydrolyzate thereof.
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