| abstract |
PROBLEM TO BE SOLVED: To provide a non-halogen and excellent flame retardancy resulting from a flame retardant effect of a siloxane unit of a siloxane-modified polyamide-imide resin and a flame retardant effect of an organic phosphorus compound, and to further provide a siloxane-modified polyamide. Various heat-resistant resin compositions, adhesive films and adhesive layers useful for various printed wiring boards or semiconductor package adhesives and adhesive films having excellent adhesiveness and heat resistance due to the stress relaxation effect caused by the microphase separation structure of the imide resin Provided is a polyimide film. A heat-resistant resin composition containing (A) a siloxane-modified polyamide-imide resin having a microphase-separated structure and (B) a thermosetting component, an adhesive film comprising the heat-resistant resin composition, and polyimide A polyimide film with an adhesive layer, wherein the adhesive film is laminated on the film as an adhesive layer. |