http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001135821-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-12
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filingDate 1999-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0542f2c4117dffda3e005c52f2cbc64
publicationDate 2001-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001135821-A
titleOfInvention Method for manufacturing semiconductor device
abstract (57) [Summary] [PROBLEMS] To use a SIMOX method to remove S directly below a gate electrode. The thickness of the OI layer is thin, the thickness of the SOI layer in the source / drain portion is thick, and a fully-depleted SOI-MOSFET having high driving capability is self-aligned. SOLUTION: A step of forming a dummy gate 17 on a semiconductor substrate 11, a step of ion-implanting oxygen into the semiconductor substrate 11, and a step of applying a heat treatment to the semiconductor substrate 11 to form a buried oxide film 18 in a region where the oxygen is ion-implanted. This is a method for manufacturing a semiconductor device, comprising: a forming step; a step of removing a dummy gate 17; and a step of forming a gate electrode 44 via a gate insulating film 41 in a region where the dummy gate 17 is removed.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6885066-B2
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