| abstract |
(57) [Summary] [PROBLEMS] To efficiently and quickly heat and cool a wafer prober, control its temperature, and prevent warpage even when a probe card is pressed. To provide a wafer prober device which is lightweight and can effectively prevent damage and measurement errors of a silicon wafer. SOLUTION: This is a wafer prober device comprising a support substrate and a ceramic substrate provided with a heating layer and a conductor layer formed on a surface thereof, wherein the support container has a fluid ejection port formed therein. Characterized wafer prober device. |