| abstract |
(57) [Abstract] [Problem] An epoxy resin molding compound for encapsulation, which can achieve flame retardancy with non-halogen and non-antimony, has good moldability, good reflow crack resistance, etc., and has excellent storage stability. And an electronic component device provided with a sealed element. An essential component is (A) a thermosetting resin having a dihydrobenzoxazine ring, (B) an epoxy resin, (C) a phenol resin, (D) a phosphoric ester, and (E) an inorganic filler. The melt viscosity at 150 ° C. of the mixture of the components (A), (B) and (C) is 2 P or less, The epoxy resin molding material for sealing, wherein the content of the component (D) is 1 to 50 parts by weight based on 100 parts by weight of the total of the components (A), (B) and (C); An electronic component device having an element sealed with an epoxy resin molding material. |