| abstract |
[PROBLEMS] To provide a cured product having excellent flexibility, heat resistance to soldering, heat degradation, electroless gold plating resistance, development with an organic solvent or a dilute alkaline solution, solder resist and interlayer insulating layer. The present invention provides a resin composition suitable for: An aromatic polyester polyol compound (a) is reacted with a polybasic acid anhydride (b) having at least two acid anhydride groups in a molecule and an ethylenically unsaturated group-containing polyhydroxy compound (c). A resin composition containing the polyester oligomer (A) obtained by the above. |