| abstract |
[PROBLEMS] To provide a cured product having excellent flexibility, heat resistance to soldering, heat degradation, electroless gold plating resistance, development with an organic solvent or a dilute alkaline solution, solder resist and interlayer insulating layer. Develop a resin composition suitable for An aromatic polyester polyol compound (a), a polybasic acid anhydride (b) having at least two acid anhydride groups in a molecule, a polyisocyanate compound (c), and an ethylenically unsaturated group-containing polyhydroxy compound Urethane oligomer (A) obtained by reacting compound (d) And a reactive diluent (B). |