| abstract |
[PROBLEMS] To provide a cured product having excellent flexibility, heat resistance to soldering, heat degradation, electroless gold plating resistance, development with an organic solvent or a dilute alkaline solution, solder resist and interlayer insulating layer. The present invention provides a resin composition suitable for: SOLUTION: 9.9-Bis [4- (2-hydroxyalkoxy) phenyl] fluorene (a) and optionally a polyol compound (b) other than the component (a) and 2 Urethane oligomer (A) obtained by reacting polybasic acid anhydride (c-1) having two acid anhydride groups with polyisocyanate compound (d) and polyhydroxy compound containing ethylenically unsaturated group (e) A resin composition containing a diluent (B). |