http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001119140-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 1999-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6bb5c69a470e738869e8a5fe440642c0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0587152f0e98544b9e8f618bfa7743c8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df7e2e46dcc2656f905e8eef7a463be5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7f25ae21d3282ee91ab3893ffa14ee7 |
| publicationDate | 2001-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001119140-A |
| titleOfInvention | Manufacturing method of wiring board |
| abstract | (57) [Problem] To provide a method for manufacturing a wiring board in which a tapered via hole can be easily obtained without changing the composition for increasing the light transmittance of an insulating resin. In a method of manufacturing a wiring board in which a hole is formed by exposing a portion other than a hole of an insulating layer using a photocurable resin and developing and removing a non-exposed portion to form a hole, A method for manufacturing a wiring board in which the developer is treated with a diluted solution. |
| priorityDate | 1999-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.