| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate |
1999-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4291a5e448ffcadee96848f0e0e73645
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa480cc633eab47074a74a63c3b23042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecc356e7b6614b3ec625cb9be79ef1f3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fff6ea23cc4f32700a9b6cb7c13b9d92
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26261a28d99332a0d84fbce9318b8158 |
| publicationDate |
2001-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001118864-A |
| titleOfInvention |
Semiconductor device manufacturing method and semiconductor device obtained thereby |
| abstract |
(57) [Problem] To provide a method for eliminating sealing defects (bubbles and the like) due to a differential pressure short circuit generated by a vacuum differential pressure printing method. SOLUTION: After mounting a semiconductor element on a substrate provided with wiring and connecting the semiconductor element and a wiring part of the substrate with a conductive metal, the semiconductor element, the connection part and the vicinity thereof are sealed with a liquid resin sealing material. A method for manufacturing a semiconductor device, wherein a liquid resin sealing material containing 5% by weight or more and 50% by weight or less of a solvent is sealed by a vacuum differential printing method. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018154835-A1 |
| priorityDate |
1999-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |