| abstract |
(57) [Problem] To provide a thermoplastic resin composition which does not generate blisters when soldering in a reflow furnace by a surface mounting method. SOLUTION: (A) 90 to 99.99 parts by weight of a thermoplastic resin having a crystal melting temperature of 200 ° C. or more, and (B) 10 to 0.01 parts by weight of a hydrophobic zeolite (provided that the components (A) and (B) (The total amount is 100 parts by weight.) And (C) a flame retardant, (D) a flame retardant auxiliary, and / or (E) an inorganic filler (wherein the component (B) And a thermoplastic resin composition comprising: |