| abstract |
(57) [Problem] To provide an epoxy resin composition having high solder heat resistance, withstanding high-temperature solder reflow, and having good moldability. An epoxy resin composition comprising an epoxy resin (A), a curing agent (B), a filler (C), and a silane coupling agent (D), wherein the epoxy resin (A) is: It is essential to contain the epoxy resin (a) represented by the specific chemical formula, and the proportion of the filler (C) is 88% of the whole. An epoxy resin composition and a semiconductor device, which are essential to be contained in an amount of about 96% by weight. |