http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001111188-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_75ef5ef54b0ca6f1abe8307086b7ce96 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 |
| filingDate | 1999-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_68eac3fa875ba4c203bece6ca3c76dde |
| publicationDate | 2001-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001111188-A |
| titleOfInvention | Circuit board and method of manufacturing the same |
| abstract | (57) [Summary] [Object] To provide a circuit board and a method for manufacturing the same, in which a conductive pattern is miniaturized and densified, and the board is reduced in size and thickness. A through-hole is formed in a required portion of a substrate having a copper foil laminated on an insulating resin substrate, and an electroless copper plating film is formed on an inner wall of the through-hole and on the copper foil layer. Then, the conductor layer is formed into a required conductor pattern 6 by etching, and the conductive paste 7 is filled in the through holes 4. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101397303-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105764245-A |
| priorityDate | 1999-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.