| abstract |
(57) [Summary] (Modified) [PROBLEMS] To provide a method for manufacturing a package element which is small, does not require a lead frame, and has excellent heat dissipation. SOLUTION: A die attachment region 22 is provided on an upper surface of a conductive material sheet 20 having excellent thermal and electrical conductivity, and a die contact 2 is provided on a lower surface. 4 and the lead contact 26 are formed by plating. A mold lock 34 is formed by plating copper 29, nickel, and palladium connection layers 31 and 33 on the upper surface facing the reed contacts 26. A semiconductor die 40 is attached on the die attachment region 22 with solder, conductive epoxy, or the like according to its characteristics, and is connected to the mold lock 34 by wire bonding 42. The entire top surface is packaged with a resin housing and cut and separated into individual elements. |