| abstract |
(57) [Summary] [PROBLEMS] Because of its high adhesive strength at heat and excellent stress relaxation, it is suitable for bonding large chips such as ICs to a copper frame. Characteristic defects such as ICs due to chip distortion can be prevented. SOLUTION: The epoxy resin comprises a combination of two kinds of epoxy resins, a liquid phenol curing agent, a latent curing agent, a curing accelerator which is a salt of a tertiary amine, and an inorganic filler, and the epoxy resin has a liquid epoxy resin and an epoxy group. This is a resin paste for semiconductors made of a reactive diluent, and is a semiconductor device made using this resin paste. |