| abstract |
(57) [Summary] [PROBLEMS] To suppress the occurrence of cracks during the manufacturing process and stably maintain Mg without causing a decrease in yield. Provided are a method for producing an ITO sputtering target and a deposition material. SOLUTION: Indium oxide powder and tin oxide powder, Alternatively, after mixing and molding indium oxide-tin oxide powder and magnesium hydroxide powder, a sintered body obtained by sintering is processed, and substantially In, Sn, Mg Of Mg-containing ITO sputtering target / evaporation material comprising O and O |