| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e43b4ca6b41ce9f54c9a895d474c81a |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
1999-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1efc63fb839c038b6364923e0d64f877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b67d35fd6aa0a02f7318fec0201dfb5c |
| publicationDate |
2001-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001089550-A |
| titleOfInvention |
Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| abstract |
[PROBLEMS] To obtain an epoxy resin composition for semiconductor encapsulation which is excellent in fluidity and mold filling properties. An epoxy resin composition containing a molecular weight control type epoxy resin and a molecular weight control type curing agent. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7968672-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006090662-A1 |
| priorityDate |
1999-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |