http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001085841-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 1999-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ebbde95e8ab905dbb6f9d7b4df465cc7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c64ae36ef27315f93e3882ad51d8093 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_815ea467d09362c06bf272228ef83a29 |
| publicationDate | 2001-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001085841-A |
| titleOfInvention | Manufacturing method of multilayer printed wiring board |
| abstract | (57) [Problem] To form a roughened surface on a surface of an interlayer resin insulating layer, a roughened surface having unevenness of uniform roughness can be formed, and an interlayer resin insulating layer and a metal layer can be formed. The present invention proposes a method for manufacturing a multilayer printed wiring board in which separation does not occur between the printed circuit board and the conductive circuit. A method of manufacturing a multilayer printed wiring board in which a conductive circuit and an interlayer resin insulating layer are sequentially laminated on a substrate, wherein the particles soluble in an acid or an oxidizing agent when the interlayer resin insulating layer is formed. Using a resin film dispersed in a resin that is hardly soluble in an acid or an oxidizing agent, and subjecting the resin film to 2.0 to 10 kgf / cm 2 under reduced pressure or vacuum. A non-through-hole and / or a through-hole after being press-bonded to the surface of the substrate including the conductor circuit under the pressure of: |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003051650-A |
| priorityDate | 1999-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 53.