| abstract |
PROBLEM TO BE SOLVED: To provide a bonding agent for electronic component mounting capable of manufacturing a high quality electronic component mounting product excellent in adhesiveness and capable of bonding an electronic component and a circuit board with good conductivity. provide. SOLUTION: 100 parts by weight of an epoxy resin, 2 to 30 parts by weight of a latent curing agent, and 300 to 900 parts by weight of conductive particles, and the tap density of the conductive particles is 4.5 g. / Cm 3 or more and an average particle diameter of 4 to 5 μm. |