http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001085807-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate | 1999-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bdd5fa335fb8eae85787f7a70bc44471 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa29c0870a7cd987194983c3983097d6 |
| publicationDate | 2001-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001085807-A |
| titleOfInvention | Wiring board |
| abstract | (57) [Summary] [PROBLEMS] To provide an external appearance defect in a wiring layer, to cause peeling or blistering between a gold plating layer and a nickel plating layer, and to firmly remove an electronic component to the wiring layer via solder. I can't wear it. A wiring board having a wiring layer to which electrodes of an electronic component are connected via solder balls, wherein at least electrodes of the electronic component in the wiring layer are connected via the solder balls. A nickel-boron plating layer 6, a palladium-phosphorus plating layer 7, and a gold plating layer 8 were sequentially deposited on the surface of the region to be formed. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003008190-A |
| priorityDate | 1999-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.