http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001085370-A

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
filingDate 1999-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d50e73799a7d1192f436e104d9cd287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_132422c38fd443000966dde6d1aa01fd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd839eefc3bbe50b91ccc0a660688086
publicationDate 2001-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001085370-A
titleOfInvention Chemical mechanical polishing composition for use in semiconductor processing
abstract (57) Abstract: A chemical mechanical polishing composition for semiconductor processing is provided, the composition comprising a water-soluble anionic chemical. The present invention provides a chemical mechanical composition as a slurry, wherein the slurry comprises 70 9999.5 wt% aqueous medium, 0.1-25 wt% abrasive, 0.01-2 wt% polishing accelerator, and 0.01 Contains 11% by weight of water-soluble anionic chemicals. The chemical mechanical polishing composition of the present invention may further contain an oxidizing agent in order to improve a polishing rate. Effect When a metal film is polished, a water-soluble anionic chemical substance is coated on the surface of the metal film, thereby preventing a depression from being formed on the metal circuit after polishing.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010188514-A
priorityDate 1999-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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