http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001081561-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bbe659a8c7f2053c720d40af4c7bd107 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E30-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G21B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G21B1-17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G21B1-11 |
| filingDate | 1999-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c6a2b2c9b141d8e2b0d5ebb13c9b9e0a |
| publicationDate | 2001-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001081561-A |
| titleOfInvention | High temperature receiver |
| abstract | (57) [Problem] To provide a high-temperature heat receiving body comprising a joined body of a high melting point metal W and a dissimilar material having a large difference in thermal expansion coefficient such as Cu. SOLUTION: A high-temperature heat receiving body 10 is formed by directly bonding a dense tungsten thick film 3 to at least a part of a substrate 2 having a larger thermal expansion coefficient than tungsten without an intermediate layer by a CVD method. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101285484-B1 |
| priorityDate | 1999-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.