http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001074806-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f7fdf2a871b42ed8d145a40c4775bf4a
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
filingDate 1999-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7905fa7c15eeb6f91d03ba75e5dd776c
publicationDate 2001-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001074806-A
titleOfInvention Multi-point connection sheet for ball-shaped bump contact of semiconductor parts
abstract [PROBLEMS] To provide a multipoint connection sheet for contacting a ball-shaped bump of a semiconductor component, which can effectively cope with a minute pitch of a ball-shaped bump in a CSP or the like and can appropriately contact the ball. The multi-point connection sheet has a large number of contact probes provided for contacting a large number of ball-shaped bumps of a semiconductor component on an insulation sheet, and the contact probe is provided on the insulation sheet. And a ring portion 3 formed by plating to be in close contact with the inner peripheral surface of the hole 8 formed. The upper annular surface 4 of the ring portion 3 is exposed on the upper surface of the insulating sheet 2. The lower dead center portion 7 of the ball-shaped bump 6 is received in the inner hole 8, and the inner peripheral edge of the upper annular surface 4 makes annular contact with the lower spherical surface of the ball-shaped bump 6 received in the hole. A multipoint connection sheet for contacting a ball-shaped bump of a semiconductor component having an annular contact seating surface 9.
priorityDate 1999-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 21.