| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38520f366e74704305b34fb93a81121e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85444
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49171
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05599
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-564
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3142 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| filingDate |
2000-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4ae3714c3c1e853468826944aa5ab67 |
| publicationDate |
2001-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001068602-A |
| titleOfInvention |
Semiconductor device |
| abstract |
(57) [Problem] To crack or peel off a resin-encapsulated semiconductor device due to a stress generated in a reflow processing step at the time of mounting on a motherboard. SOLUTION: A dummy pattern 301 is formed on a surface of a base substrate 101 between a midpoint of a long side of the base substrate 101 and a semiconductor chip 113. This dummy pattern 3 01 has a relatively low adhesion strength to the sealing resin 117. The stress generated during the reflow process is released through the interface between the dummy pattern 301 and the sealing resin 117. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-1315188-C
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019149468-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006332106-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7017093-B2 |
| priorityDate |
1999-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |