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inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95201fedeb204497c575cc499ea7b4a8
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publicationDate 2001-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001068312-A
titleOfInvention Radio wave absorption heat conduction sheet
abstract (57) [Problem] To provide a radio wave absorbing heat conductive sheet having both properties of noise radio wave absorption and high thermal conductivity for absorbing generated heat and guiding it to the outside. By having a surface, the electromagnetic wave absorbing heat conductive sheet 1 that can be directly mounted between the semiconductor element such as the CPU 2 and the heat sink 3 without mediating a member such as an adhesive material has a heat resistant temperature of 150 ° C. or more and a rubber hardness of 50 or less. Is a flexible sheet. When the sheet is soft, the degree of adhesion at the mounting portion when mounted on an electronic circuit is improved, so that heat and electromagnetic waves generated from the semiconductor element are well absorbed. Further, 100 parts by weight of liquid silicone resin and soft magnetic powder 3 By constituting the radio wave absorbing heat conductive sheet 1 in a ratio of 00 parts by weight to 100 parts by weight of the nonmagnetic inorganic powder, particularly 100 parts by weight A radio wave absorbing heat conductive sheet having high radio wave absorption at up to several GHz and good heat conductivity.
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