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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
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filingDate 1999-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac00bde840d86a9ded01005a0caf3934
publicationDate 2001-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001064362-A
titleOfInvention Epoxy resin composition and semiconductor device
abstract (57) [Summary] (Modified) [PROBLEMS] An epoxy resin composition for semiconductor encapsulation which is substantially free of brominated epoxy resin and antimony oxide as a flame retardant and is environmentally friendly. (A) An epoxy resin obtained by glycidyl etherification of a mixture of a bisphenol F (a) represented by the general formula (1) and a biphenol (b) represented by the general formula (2), (B) phenol A modified novolak resin obtained by condensing (c) and cresols (d) via an aldehyde, (C) an inorganic filler, and (D) a curing accelerator as essential components. The weight ratio (a / b) is 0.1 to 10, and the molar ratio (c / d) between phenol (c) and cresols (d) in the modified novolak type resin Is 0.1 to 10, the equivalent ratio of phenolic hydroxyl groups of all phenolic resins to epoxy groups of all epoxy resins is 0.5 to 2.0, and the content of the curing accelerator (D) is 0.1 to 2.0. It is 4 to 20 parts by weight. (However, R 1 and R 2 in the formula represent an alkyl group, m is an integer of 0-4. )
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010043245-A
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