http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001064360-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 |
| filingDate | 1999-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8bf27b15f969ca035ab9b706a455dbe2 |
| publicationDate | 2001-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001064360-A |
| titleOfInvention | Liquid sealing resin composition and semiconductor device using the same |
| abstract | (57) [Problem] To provide a liquid sealing resin composition having higher reliability in a liquid sealing resin composition for sealing a semiconductor element or the like. (A) an epoxy resin represented by the formula (1); (B) a liquid epoxy resin having an average epoxy group of 2 or more excluding the epoxy resin represented by the formula (1); (C) a curing agent; ) A liquid sealing resin composition comprising silica. Further, the present invention is a semiconductor device manufactured by sealing a semiconductor element using the above liquid sealing resin composition. Embedded image |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110475767-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018180451-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020170867-A |
| priorityDate | 1999-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.