http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001053054-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-84
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filingDate 1999-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c78cddef81b8330697f0e723070af650
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_53e27e5d4d3466fb74bc635555675bb6
publicationDate 2001-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001053054-A
titleOfInvention Manufacturing method of semiconductor parts
abstract (57) [Problem] To improve the yield by protecting other normal semiconductor components even if some semiconductor components are damaged while etching a silicon wafer. SOLUTION: On the front side of a silicon wafer 11, a deflection detecting section 4 and a wiring section 5 of each pressure sensor are formed, and on the back side, a concave groove 6 for a diaphragm section 3 is formed by etching. Then, at the time of etching the concave groove 6, protective films 13 and 14 made of a photosensitive resin material or the like are formed in advance for each pressure sensor 1, and the seal ring 16 is formed. The etching liquid is brought into contact with the back surface while the front surface is sealed by, for example, the above. Thus, even when the diaphragm 3 of some of the pressure sensors is damaged, it is possible to prevent the other normal pressure sensors from being damaged by the etchant entering the surface side.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018031797-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10238299-B4
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006231059-A
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Total number of triples: 29.