| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_294881271413951a95f284b588a68e66 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 |
| filingDate |
2000-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4ce0fc5cc7d393e8d19dc9e5f23e309
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f562c2f7991cb7d0a4b2fdc592bb1ca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05acd97ccd400399dba427f7a110a89b |
| publicationDate |
2001-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001047276-A |
| titleOfInvention |
Solder material |
| abstract |
(57) [Problem] To provide a solder material excellent in mechanical strength characteristics and wetting characteristics. SOLUTION: Sn-Ag alloy or Sn-Ag-Bi- A rare earth element and germanium are added to a Cu-based alloy. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012500493-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105195916-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105195916-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105195914-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114535860-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105290641-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008188672-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6067152-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015121939-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008084603-A1 |
| priorityDate |
1999-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |