http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001044643-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate | 1999-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22bccf4e7640f08285550ec8cbc42184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3900ed3941ab8c0e21952b6f565f611e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1002fc9584389f53cc07bea235866b1d |
| publicationDate | 2001-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001044643-A |
| titleOfInvention | Method for manufacturing high density multilayer printed wiring board |
| abstract | PROBLEM TO BE SOLVED: To provide a production method for directly irradiating a high-output carbon dioxide gas laser to a copper-clad multilayer board used for a printed wiring board to form small-diameter through holes and / or via holes. Provided is a method for manufacturing a printed wiring board which is free from displacement of land copper foil and has excellent connection reliability between an inner copper foil and front and back copper foils. SOLUTION: A metal oxidation treatment is performed on a copper foil of a copper-clad multilayer board having at least three or more copper foil layers, and a high-output carbon dioxide laser is directly irradiated from above on the copper foil to form an outer layer and an inner layer copper. After forming through holes and / or via holes including the foil, the front and back surfaces of the copper foil and the generated inner and outer layer copper foil burrs are removed by etching with an alkaline solution, and the copper obtained by performing copper plating after removing the copper oxide treated layer. A printed wiring board is created using the laminated multilayer board. [Effect] It is possible to remove the copper burrs on the inner and outer layers of the through hole for the through hole and / or the via hole, and the connection between the surface copper foil and the copper foil inside the hole is very good, and the reliability is excellent. Through holes were obtained. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007129147-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4694349-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2228261-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005340785-A |
| priorityDate | 1999-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 81.