| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_40a562ada2a4ad540fd037a6bef7ee0f |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 |
| filingDate |
1999-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_73a47bf6dfda5d7276648249dc26692f |
| publicationDate |
2001-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001040498-A |
| titleOfInvention |
Electronic components coated with tin-copper alloy plating film |
| abstract |
PROBLEM TO BE SOLVED: To provide a tin-copper alloy film excellent in solderability after heat treatment, which can be substituted for a tin-lead alloy plating film, and an electronic component coated with the film. SOLUTION: A tin-copper alloy film having a carbon content of 0.3% by weight or less and an electronic component coated with the film. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009299123-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4753502-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006193778-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006009102-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-RE45987-E
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003082499-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114990651-A |
| priorityDate |
1999-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |