| abstract |
(57) [Problem] To provide a method of manufacturing a wafer level chip scale package using a rewiring substrate. SOLUTION: A substrate base layer, a plurality of terminal pads provided on the substrate base layer, a plurality of bonding bumps 128, Providing a rewiring board 130 having a metal wiring layer 122 for connecting the bonding bumps 128 to the terminal pads 116; and re-mounting the semiconductor wafer 100 on which the plurality of integrated circuits and the plurality of chip pads 104 are provided. Bonding the semiconductor device 100 with the bonding bumps 128 so that the bonding bumps 128 contact the chip pads 104 of the semiconductor wafer 100; and forming a plurality of external connection terminals 136 on each terminal pad 116 of the wiring substrate 130. And cutting the semiconductor wafer 100 and the redistribution substrate 130 to obtain an individual semiconductor package. |